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HY27US08561A Datasheet (PDF) - Hynix Semiconductor

HY27US08561A Datasheet PDF - Hynix Semiconductor
Part # HY27US08561A
Download  HY27US08561A Download
File Size   428.98 Kbytes
Page   47 Pages
Manufacturer  HYNIX [Hynix Semiconductor]
Direct Link  http://www.skhynix.com/kor/main.do
Logo HYNIX - Hynix Semiconductor
Description 256Mbit (32Mx8bit / 16Mx16bit) NAND Flash

HY27US08561A Datasheet (PDF)

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HY27US08561A Datasheet PDF - Hynix Semiconductor

Part # HY27US08561A
Download  HY27US08561A Click to download

File Size   428.98 Kbytes
Page   47 Pages
Manufacturer  HYNIX [Hynix Semiconductor]
Direct Link  http://www.skhynix.com/kor/main.do
Logo HYNIX - Hynix Semiconductor
Description 256Mbit (32Mx8bit / 16Mx16bit) NAND Flash

HY27US08561A Datasheet (HTML) - Hynix Semiconductor


HY27US08561A Product details

SUMMARY DESCRIPTION

The HYNIX HY27(U/S)S(08/16)561A series is a 32Mx8bit with spare 8Mx16 bit capacity. The device is offered in 1.8V Vcc Power Supply and in 3.3V Vcc Power Supply.

Its NAND cell provides the most cost-effective solution for the solid state mass storage market.

The memory is divided into blocks that can be erased independently so it is possible to preserve valid data while old data is erased.

The device contains 2048 blocks, composed by 32 pages consisting in two NAND structures of 16 series connected Flash cells.

A program operation allows to write the 512-byte page in typical 200us and an erase operation can be performed in typical 2ms on a 16K-byte(X8 device) block.

Data in the page mode can be read out at 50ns cycle time per byte. The I/O pins serve as the ports for address and data input/output as well as command input. This interface allows a reduced pin count and easy migration towards different densities, without any rearrangement of footprint.



FEATURES SUMMARY

HIGH DENSITY NAND FLASH MEMORIES

   - Cost effective solutions for mass storage applications



NAND INTERFACE

   - x8 or x16 bus width.

   - Multiplexed Address/ Data

   - Pinout compatibility for all densities



SUPPLY VOLTAGE

   - 3.3V device: VCC = 2.7 to 3.6V : HY27USXX561A

   - 1.8V device: VCC = 1.7 to 1.95V : HY27SSXX561A



Memory Cell Array

   = (512+16) Bytes x 32 Pages x 2,048 Blocks

   = (256+8) Words x 32 pages x 2,048 Blocks



PAGE SIZE

   - x8 device : (512 + 16 spare) Bytes

                   : HY27(U/S)S08561A

   - x16 device: (256 + 8 spare) Words

                  : HY27(U/S)S16561A



BLOCK SIZE

   - x8 device: (16K + 512 spare) Bytes

   - x16 device: (8K + 256 spare) Words



PAGE READ / PROGRAM

   - Random access: 3.3V: 12us (max.)

                           1.8V: 15us (max.)

   - Sequential access: 3.3V: 50ns (min.)

                             1.8V: 60ns (min.)

   - Page program time: 200us (typ.)



COPY BACK PROGRAM MODE

   - Fast page copy without external buffering



 




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About Hynix Semiconductor


Hynix Semiconductor is a South Korean company that specializes in the design and manufacture of memory semiconductors.
The company was founded in 1983 and is headquartered in Icheon, South Korea.
Hynix is one of the world's leading producers of DRAM (dynamic random access memory) and NAND flash memory, which are used in various applications such as computer systems, mobile devices, and solid-state drives.
Hynix is known for its expertise in memory semiconductor technology and its ability to deliver high-quality and high-performance memory products to its customers.
The company has operations and facilities in various countries across the world and works closely with its customers to provide customized memory solutions that meet their specific requirements and needs.
In addition to its memory products, Hynix also provides a range of products and solutions for the automotive and data center markets, such as system-on-a-chip (SoC) products and high-bandwidth memory (HBM) products.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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