0440672001 Datasheet(PDF) - Molex Electronics Ltd.

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0440672001 Datasheet (PDF) - Molex Electronics Ltd.

0440672001 Datasheet PDF - Molex Electronics Ltd.


Part #	0440672001

Download	0440672001 Download

File Size	216.01 Kbytes

Page	3 Pages

Manufacturer	MOLEX6 [Molex Electronics Ltd.]

Direct Link	http://www.molex.com

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Description

3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 20 Circuits, Tin (Sn) Plating

0440672001 Datasheet (PDF)

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0440672001 Datasheet PDF - Molex Electronics Ltd.


Part #	0440672001

Download	0440672001 Click to download

File Size	216.01 Kbytes

Page	3 Pages

Manufacturer	MOLEX6 [Molex Electronics Ltd.]

Direct Link	http://www.molex.com

Logo

Description	3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 20 Circuits, Tin (Sn) Plating

0440672001 Datasheet (HTML) - Molex Electronics Ltd.

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Similar Part No. - 0440672001

Manufacturer	Part #	Datasheet	Description
Molex Electronics Ltd.	0440672002	216Kb / 3P	3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for upto 3.56mm (.140") Thick PCB, 2 Circuits, 0.38關m (15關") Gold (Au) Selective Plating

Similar Description - 0440672001

Manufacturer	Part #	Datasheet	Description
Molex Electronics Ltd.	0440670601	216Kb / 3P	3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating
	0440671801	216Kb / 3P	3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 18 Circuits, Tin (Sn) Plating
	0440671201	216Kb / 3P	3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, Tin (Sn) Plating
	0440671602	216Kb / 3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
	0440671202	216Kb / 3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
	0440671401	216Kb / 3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
	0440670402	216Kb / 3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
	0440670401	216Kb / 3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
	0440671802	216Kb / 3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
	0440672401	216Kb / 3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB

About Molex Electronics Ltd.

Molex Electronics Ltd. is a subsidiary of Koch Industries, Inc., and is a global manufacturer of electronic and fiber optic interconnect solutions.

The company was founded in 1938 and is headquartered in Lisle, Illinois.

Molex offers a wide range of interconnect products including connectors, cable assemblies, switches, and other passive components.

These products are used in various industries including automotive, data communications, consumer electronics, industrial equipment, medical devices, and telecommunications.

With operations and facilities in over 40 countries, Molex is known for its innovation and technology leadership in the interconnect solutions market.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.

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