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0879140216 Datasheet (PDF) - Molex Electronics Ltd.
0879140216 Datasheet PDF - Molex Electronics Ltd.
Part # 0879140216
Download  0879140216 Download
File Size   3781.82 Kbytes
Page   48 Pages
Manufacturer  MOLEX10 [Molex Electronics Ltd.]
Direct Link  http://www.molex.com
Logo MOLEX10 - Molex Electronics Ltd.
Description 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 2 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

0879140216 Datasheet (PDF)

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0879140216 Datasheet PDF - Molex Electronics Ltd.

Part # 0879140216
Download  0879140216 Click to download

File Size   3781.82 Kbytes
Page   48 Pages
Manufacturer  MOLEX10 [Molex Electronics Ltd.]
Direct Link  http://www.molex.com
Logo MOLEX10 - Molex Electronics Ltd.
Description 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 2 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

0879140216 Datasheet (HTML) - Molex Electronics Ltd.




Similar Part No. - 0879140216

ManufacturerPart #DatasheetDescription
logo
Molex Electronics Ltd.		 0879140001 MOLEX10-0879140001 Datasheet
3Mb / 48P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 10 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
0879140009 MOLEX10-0879140009 Datasheet
3Mb / 48P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 6 Circuits, Gold (Au) Flash Overall Plating, Tray Packaging, Lead-free
0879140416 MOLEX10-0879140416 Datasheet
3Mb / 48P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 4 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0879140616 MOLEX10-0879140616 Datasheet
3Mb / 48P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 6 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0879140806 MOLEX10-0879140806 Datasheet
770Kb / 11P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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Similar Description - 0879140216

ManufacturerPart #DatasheetDescription
logo
Molex Electronics Ltd.		 0879144016 MOLEX10-0879144016 Datasheet
3Mb / 48P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 40 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0879143416 MOLEX10-0879143416 Datasheet
3Mb / 48P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0879142416 MOLEX10-0879142416 Datasheet
3Mb / 48P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 24 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0879142616 MOLEX10-0879142616 Datasheet
3Mb / 48P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 26 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0879142816 MOLEX10-0879142816 Datasheet
3Mb / 48P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0879144416 MOLEX10-0879144416 Datasheet
3Mb / 48P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 44 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0879140816 MOLEX10-0879140816 Datasheet
3Mb / 48P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0879141216 MOLEX10-0879141216 Datasheet
3Mb / 48P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 12 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0879144216 MOLEX10-0879144216 Datasheet
3Mb / 48P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 42 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0879141816 MOLEX10-0879141816 Datasheet
3Mb / 48P		 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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About Molex Electronics Ltd.

Molex Electronics Ltd. is a subsidiary of Koch Industries, Inc., and is a global manufacturer of electronic and fiber optic interconnect solutions.

The company was founded in 1938 and is headquartered in Lisle, Illinois.

Molex offers a wide range of interconnect products including connectors, cable assemblies, switches, and other passive components.

These products are used in various industries including automotive, data communications, consumer electronics, industrial equipment, medical devices, and telecommunications.

With operations and facilities in over 40 countries, Molex is known for its innovation and technology leadership in the interconnect solutions market.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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