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W971GG6JB Datasheet (PDF) - Winbond

W971GG6JB Datasheet PDF - Winbond
Part # W971GG6JB
Download  W971GG6JB Download
File Size   1498.7 Kbytes
Page   87 Pages
Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond
Description 8M ??8 BANKS ??16 BIT DDR2 SDRAM

W971GG6JB Datasheet (PDF)

Go To PDF Page Download Datasheet
W971GG6JB Datasheet PDF - Winbond

Part # W971GG6JB
Download  W971GG6JB Click to download

File Size   1498.7 Kbytes
Page   87 Pages
Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond
Description 8M ??8 BANKS ??16 BIT DDR2 SDRAM

W971GG6JB Datasheet (HTML) - Winbond


W971GG6JB Product details

GENERAL DESCRIPTION

The W971GG6JB is a 1G bits DDR2 SDRAM, organized as 8,388,608 words 8 banks 16 bits. This device achieves high speed transfer rates up to 1066Mb/sec/pin (DDR2-1066) for various applications. W971GG6JB is sorted into the following grade parts: -18, -25, 25L, 25I, 25A, 25K, -3 and -3A. The -18 grade parts is compliant to the DDR2-1066 (6-6-6) specification. The -25/25L/25I/25A/25K grade parts are  compliant  to  the  DDR2-800  (5-5-5)  specification  (the  25L  grade  parts  is  guaranteed  to  support IDD2P = 7 mA and IDD6 = 4 mA at commercial temperature, the 25I industrial grade parts is guaranteed to  support  -40°C  ≤  TCASE  ≤  95°C).  The  -3/-3A  grade  parts  is  compliant  to  the  DDR2-667  (5-5-5) specification.



FEATURES

Power Supply: VDD, VDDQ = 1.8 V ± 0.1 V

Double Data Rate architecture: two data transfers per clock cycle

CAS Latency: 3, 4, 5, 6 and 7

Burst Length: 4 and 8

Bi-directional, differential data strobes (DQS and DQS) are transmitted / received with data

Edge-aligned with Read data and center-aligned with Write data

DLL aligns DQ and DQS transitions with clock

Differential clock inputs (CLK and CLK)

Data masks (DM) for write data

Commands entered on each positive CLK edge, data and data mask are referenced to both edges of DQS

Posted CAS programmable additive latency supported to make command and data bus efficiency

Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)

Off-Chip-Driver  impedance  adjustment  (OCD)  and  On-Die-Termination  (ODT)  for  better  signal quality

Auto-precharge operation for read and write bursts

Auto Refresh and Self Refresh modes

Precharged Power Down and Active Power Down

Write Data Mask

Write Latency = Read Latency - 1 (WL = RL - 1)

Interface: SSTL_18

Packaged in WBGA 84 Ball (8X12.5 mm2), using Lead free materials with RoHS compliant




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