Manufacturer | Part # | Datasheet | Description |
ON Semiconductor |
NCS2302
|
81Kb / 8P |
Headset Detection Interface Interface
June, 2014 ??Rev. 3 |
NCS2300
|
401Kb / 7P |
Headset Detection Interface Interface
June, 2014 ??Rev. 5 |
Texas Instruments |
TLV320DAC3202
|
605Kb / 19P |
[Old version datasheet] LOW POWER HIGH FIDELITY I2S INPUT HEADSET IC
|
SHENZHEN FUMAN ELECTRON... |
FM5401
|
731Kb / 11P |
Bluetooth Headset Mobile Power Management IC
|
Maxim Integrated Produc... |
MAX9880A
|
1Mb / 70P |
Low-Power, High-Performance Dual I2S Stereo Audio Codec Comprehensive Headset Detection
Rev 1; 3/11 |
Marki Microwave |
DPX-3
|
460Kb / 2P |
Low Profile Miniaturized, Reflow Solderable Package Option
|
DPX-1
|
456Kb / 2P |
Low Profile Miniaturized, Reflow Solderable Package Option
|
DPX-2
|
330Kb / 2P |
Low Profile Miniaturized, Reflow Solderable Package Option
|
DPX-4
|
459Kb / 2P |
Low Profile Miniaturized, Reflow Solderable Package Option
|
DPX-M50
|
338Kb / 3P |
Low Profile Miniaturized, Reflow Solderable Package Option
|