| Manufacturer | Part # | Datasheet | Description |
 Molex Electronics Ltd. |
44067-0201
|
216Kb / 3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
|
44067-0401
|
216Kb / 3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
|
44067-0402
|
216Kb / 3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
|
44067-0403
|
216Kb / 3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
|
|
44067-0601
|
216Kb / 3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating
|