| Manufacturer | Part # | Datasheet | Description |
 Molex Electronics Ltd. |
70246-0801
|
187Kb / 4P |
2.54mm (.100) Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
|
70246-0802
|
187Kb / 4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70246-1001
|
187Kb / 4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70246-1002
|
187Kb / 4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70246-1004
|
188Kb / 4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.13關m (5關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|