| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
0879202003
|
1Mb / 16P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 20 Circuits, Tin (Sn) Overall Plating, with Pick-and-Place Cap, without Peg
|
|
0879200830
|
1Mb / 12P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 2.50關m (98關) Tin (Sn) Plating, with Pick-and-Place Cap
|
|
0879208147
|
1Mb / 13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Plating, with Pick-and-Place Cap, with Peg, Tube Packaging
|
|
0878982466
|
1Mb / 19P |
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 24 Circuits , 2.50關m (98關) Tin (Sn) Plating, Tube Packaging, without Cap, Lead-free
|
|
0878980866
|
1Mb / 19P |
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 8 Circuits, 2.50關m (98關) Tin (Sn) Plating, Tube Packaging, without Cap, Lead-free
|
|
0879209047
|
1Mb / 13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, 2.50關m (98關) Tin (Sn) Plating, without Cap, with Peg, Tube Packaging, Lead-free
|
|
0878982066
|
1Mb / 19P |
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 20 Circuits, 2.50關m (98關) Tin (Sn) Plating, Tube Packaging, without Cap, Lead-free
|
|
0879208115
|
1Mb / 13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Plating, with Pick-and-Place Cap, with Peg, Tape and Reel
|
|
0879200014
|
1Mb / 13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, Tin (Sn) Overall Plating, with Pick-and-Place Cap
|
|
0878980666
|
1Mb / 19P |
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 6 Circuits, 2.50關m (98關) Tin (Sn) Plating, Tube Packaging, without Cap, Lead-free
|
|
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