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CD4511BF Marking, CD4511BF Datasheet(PDF) 6 Page - Texas Instruments

Part # CD4511BF
Description  CMOS BCD-to-7-Segment Latch Decoder Drivers
PDF  20 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

CD4511BF Datasheet(HTML) 6 Page - Texas Instruments

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PACKAGE OPTION ADDENDUM
www.ti.com
29-May-2025
PACKAGING INFORMATION
Orderable part number
Status
(1)
Material type
(2)
Package | Pins
Package qty | Carrier
RoHS
(3)
Lead finish/
Ball material
(4)
MSL rating/
Peak reflow
(5)
Op temp (°C)
Part marking
(6)
CD4511BE
Active
Production
PDIP (N) | 16
25 | TUBE
Yes
NIPDAU
N/A for Pkg Type
-55 to 125
CD4511BE
CD4511BE.A
Active
Production
PDIP (N) | 16
25 | TUBE
Yes
NIPDAU
N/A for Pkg Type
-55 to 125
CD4511BE
CD4511BEE4
Active
Production
PDIP (N) | 16
25 | TUBE
Yes
NIPDAU
N/A for Pkg Type
-55 to 125
CD4511BE
CD4511BF
Active
Production
CDIP (J) | 16
25 | TUBE
No
SNPB
N/A for Pkg Type
-55 to 125
CD4511BF
CD4511BF.A
Active
Production
CDIP (J) | 16
25 | TUBE
No
SNPB
N/A for Pkg Type
-55 to 125
CD4511BF
CD4511BF3A
Active
Production
CDIP (J) | 16
25 | TUBE
No
SNPB
N/A for Pkg Type
-55 to 125
CD4511BF3A
CD4511BF3A.A
Active
Production
CDIP (J) | 16
25 | TUBE
No
SNPB
N/A for Pkg Type
-55 to 125
CD4511BF3A
CD4511BNSR
Active
Production
SOP (NS) | 16
2000 | LARGE T&R
Yes
NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4511B
CD4511BNSR.A
Active
Production
SOP (NS) | 16
2000 | LARGE T&R
Yes
NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4511B
CD4511BNSRG4
Active
Production
SOP (NS) | 16
2000 | LARGE T&R
Yes
NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4511B
CD4511BPW
Obsolete
Production
TSSOP (PW) | 16
-
-
Call TI
Call TI
-55 to 125
CM511B
CD4511BPWR
Active
Production
TSSOP (PW) | 16
2000 | LARGE T&R
Yes
NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM511B
CD4511BPWR.A
Active
Production
TSSOP (PW) | 16
2000 | LARGE T&R
Yes
NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM511B
(1) Status: For more details on status, see our product life cycle.
(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,
reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional
waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.
(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.
(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum
column width.
(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.
Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.
(6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.
Addendum-Page 1



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