MMSZ5225 to MMSZ5267

www.vishay.com

Vishay Semiconductors

Rev. 1.9, 27-Feb-13

1

Document Number: 85774

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Small Signal Zener Diodes

FEATURES

• Silicon planar Zener diodes

• Standard Zener voltage tolerance is ± 5 % with

a “B” suffix (e.g.: MMSZ5225B), suffix “C” is

± 2 % tolerance

• AEC-Q101 qualified

• ESD capability according to AEC-Q101:

Human body model > 8 kV

Machine model > 800 V

• Base P/N-E3 - RoHS-compliant, commercial grade

• Base P/N-HE3 - RoHS-compliant, AEC-Q101 qualified

• Material categorization: For definitions of compliance

PRIMARY CHARACTERISTICS

PARAMETER

VALUE

UNIT

3.3 to 75

V

1.7 to 20

mA

Thermal equilibrium

Int. construction

Single

ORDERING INFORMATION

DEVICE NAME

ORDERING CODE

TAPED UNITS PER REEL

MINIMUM ORDER QUANTITY

MMSZ5225 to

MMSZ5267

MMSZ5225B-E3-08 to MMSZ5267B-E3-08

3000 (8 mm tape on 7" reel)

15 000/box

MMSZ5225C-E3-08 to MMSZ5267C-E3-08

MMSZ5225B-HE3-08 to MMSZ5267B-HE3-08

MMSZ5225C-HE3-08 to MMSZ5267C-HE3-08

MMSZ5225B-E3-18 to MMSZ5267B-E3-18

10 000 (8 mm tape on 13" reel)

10 000/box

MMSZ5225C-E3-18 to MMSZ5267C-E3-18

MMSZ5225B-HE3-18 to MMSZ5267B-HE3-18

MMSZ5225C-HE3-18 to MMSZ5267C-HE3-18

PACKAGE

PACKAGE NAME

WEIGHT

MOLDING COMPOUND

FLAMMABILITY RATING

MOISTURE SENSITIVITY

LEVEL

SOLDERING CONDITIONS

SOD-123

10.3 mg

UL 94 V-0

MSL level 1

(according J-STD-020)

260 °C/10 s at terminals

PARAMETER

TEST CONDITION

SYMBOL

VALUE

UNIT

Power dissipation

minimum recommended solder pad layout

500

mW

Zener current

See table “Electrical Characteristics”

Thermal resistance junction to ambient air

On FR - 4 or FR - 5 board with minimum

recommended solder pad layout

340

K/W

Junction temperature

150

°C

Storage temperature range

- 65 to + 150

Operating temperature range

- 55 to + 150