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LMH6704MF Datasheet(PDF) 3 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # LMH6704MF
Description  650 MHz Progammable Gain Buffer with Disable
PDF  12 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LMH6704MF Datasheet(HTML) 3 Page - National Semiconductor (TI)

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Electrical Characteristics (Note 2) (Continued)
T
A = +25˚C , AV = +2, VS = ±5V, RL = 100
Ω; unless specified.
Symbol
Parameter
Conditions
Min
(Note 6)
Typ
(Note 6)
Max
(Note 6)
Units
CMIR
Common Mode Input Range
V
IO
≤ 15 mV
±1.9
±2V
PSRR
Power Supply Rejection Ratio
DC
48
47
52
dB
V
O
Output Voltage Swing
R
L =
±3.3
±3.18
±3.5
V
R
L = 100
±3.2
±3.12
±3.5
I
O
Linear Output Current
V
OUT
≤ 80 mV
±55
±90
mA
I
S
Supply Current (Enabled)
DIS = 2V, R
L =
11.5
12.5
13.7
mA
Supply Current (Disabled)
DIS = 0.8V, R
L =
0.25
0.9
0.925
R
F &RG
Internal R
F and RG
375
465
563
R
OUT
Closed Loop Output Resistance
DC
0.05
R
IN+
Input Resistance
1M
C
IN+
Input Capacitance
1pF
Enable/Disable Performance (Disabled Low)
T
ON
Enable Time
10
ns
T
OFF
Disable Time
10
ns
Output Glitch
50
mV
PP
V
IH
Enable Voltage
DIS
≥ V
IH
2.0
V
V
IL
Disable Voltage
DIS
≤ V
IL
0.8
I
IH
Disable Input Bias Current, High
DIS = V
+, (Note 7)
−1
±50
µA
I
IL
Disable Input Bias Current, Low
DIS = 0V (Note 7)
0
−100
−350
µA
I
OZ
Disabled Output Leakage
Current
A
V = +1, VOUT = ±1.8V
0.2
±25
±50
µA
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications, see the Electrical Characteristics tables.
Note 2: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of
the device such that TJ =TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA.
Min/Max ratings are based on production testing unless otherwise specified.
Note 3: The maximum output current (IOUT) is determined by device power dissipation limitations.
Note 4: Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)
Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
Note 5: Slew Rate is the average of the rising and falling edges.
Note 6: Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will
also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.
Note 7: Negative current implies current flowing out of the device.
Note 8: The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD =(TJ(MAX) –TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.
www.national.com
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