iW1680 Product Summary

Digital PWM AC/DC Controller

Revison 0.5 Preliminary

iW1680

© 2014 Dialog Semiconductor GmbH

Product Summary

4 of 6

6.0 Physical Dimensions

1

3

4

6

5

2

6-Lead SOT Package

D

Compliant to JEDEC Standard MO-178AB

Controlling dimensions are in millimeters

This package is RoHS compliant and Halide free.

Soldering Temperature Resistance:

[a] Package is IPC/JEDEC Std 020D Moisture Sensitivity Level 1

[b] Package exceeds JEDEC Std No. 22-A111 for Solder Immersion Resistance;

packages can withstand 10 s immersion < 260ºC

Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions

or gate burrs shall not exceed 0.25 mm per side.

The package top may be smaller than the package bottom. Dimensions D and E1 are

are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar

burrs and interlead flash, but including any mismatch between top and bottom of the plastic

body.

SEATING

PLANE

A1

COPLANARITY

0.10

E1

B

e

e1

A

A2

C

L

α

Millimeters

A1

MIN

MAX

0.00

0.15

A

-

1.45

B

0.30

0.50

C

0.08

0.22

D

2.80

3.00

E

E1

e

0.95 BSC

e1

1.90 BSC

2.80 BSC

1.60 BSC

L

0.30

0.60

0°

8°

α

A2

0.90

1.30

E

2.90 BSC

1

3

4

6

5

2

XYZN

SOT23-6 devices are marked with a 4-digit code. Orientation of Pin 1 is shown below: