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IW1818 Datasheet(PDF) 4 Page - Dialog Semiconductor |
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IW1818 Datasheet(HTML) 4 Page - Dialog Semiconductor |
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4 / 6 page ![]() iW1818 Off-Line Digital Green-Mode Quasi-Resonant PWM Controller Integrated with Power BJT Rev. 1.0 Product Summary © 2016 Dialog Semiconductor www.dialog-semiconductor.com 4 of 6 15-April-2016 Parameter Symbol Value Units DC supply voltage range (pin 5, ICC = 20mA max) VCC -0.3 to 25 V Continuous DC supply current at VCC pin (VCC = 15V) ICC 20 mA VSENSE input (pin 4, IVsense ≤ 10mA) -0.7 to 4.0 V ISENSE input (pin 2) -0.3 to 4.0 V ESD rating per JEDEC HBM 2000 V MM 200 CDM 1000 Latch-up test per JESD78A ±100 mA Collector-Emitter breakdown voltage (Emitter and base shorted together; IC = 1mA, REB = 0Ω) VCES 800 V Collector current (Note 1) IC 4 A Collector peak current (Note 1) (tp < 1ms) ICM 8 A Maximum junction temperature TJMAX 150 °C Storage temperature TSTG -55 to 150 °C Notes: Note 1. Limited by maximum junction temerature. Absolute maximum ratings are the parameter values or ranges that can cause permanent damage if exceeded. For maximum safe operating conditions, refer to Electrical Characteristics in Section 7. (TA = 25°C, unless otherwise noted). Proper design precautions must be made to ensure that the internal die junction temperature of the iW1818 does not exceed 150°C. Otherwise permanent damage to the device may occur. 5 Absolute Maximum Ratings 6 Thermal Characteristics Parameter Symbol Value Units Thermal Resistance Junction-to-Ambient (Note 1) (Dissipated power 0.9W) θJA 80 °C/W Thermal Resistance Junction-to-GND pin (pin 3) (Note 2) (Dissipated power 0.9W) ψJB 25 °C/W Thermal Resistance Junction-to-Collector pin (Note 2) (Dissipated power 0.9W) ψJ-BJT 35 °C/W Thermal Shutdown Threshold (Note 3) TSD 150 °C Thermal Shutdown Recovery (Note 3) TSD-R 120 °C Notes: Note 1. θJA is measured in a one-cubic-foot natural convection chamber. Note 2. ψJB [Psi Junction to Board] provides an estimation of the die junction temperature relative to the PCB [Board] surface temperature. ψJ-BJT [Psi Junction to Collector pin] provides an estimation of the die junction temperature relative to the collector pin [internal BJT Collector] surface temperature. ψJB is measured at the ground pin (pin 3) without using any thermal adhesives. See Section 10.14 for more information. Note 3. These parameters are typical and they are guaranteed by design. |
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