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IW1818 Datasheet(PDF) 4 Page - Dialog Semiconductor

Part # IW1818
Description  Off-Line Digital Green-Mode Quasi-Resonant
PDF  6 Pages
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Manufacturer  DIALOG [Dialog Semiconductor]
Direct Link  http://www.dialog-semiconductor.com/
Logo DIALOG - Dialog Semiconductor

IW1818 Datasheet(HTML) 4 Page - Dialog Semiconductor

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iW1818
Off-Line Digital Green-Mode Quasi-Resonant
PWM Controller Integrated with Power BJT
Rev. 1.0
Product Summary
© 2016 Dialog Semiconductor
www.dialog-semiconductor.com
4 of 6
15-April-2016
Parameter
Symbol
Value
Units
DC supply voltage range (pin 5, ICC = 20mA max)
VCC
-0.3 to 25
V
Continuous DC supply current at VCC pin (VCC
= 15V)
ICC
20
mA
VSENSE input (pin 4, IVsense ≤ 10mA)
-0.7 to 4.0
V
ISENSE input (pin 2)
-0.3 to 4.0
V
ESD rating per JEDEC
HBM
2000
V
MM
200
CDM
1000
Latch-up test per JESD78A
±100
mA
Collector-Emitter breakdown voltage
(Emitter and base shorted together; IC = 1mA, REB = 0Ω)
VCES
800
V
Collector current (Note 1)
IC
4
A
Collector peak current (Note 1) (tp < 1ms)
ICM
8
A
Maximum junction temperature
TJMAX
150
°C
Storage temperature
TSTG
-55 to 150
°C
Notes:
Note 1.
Limited by maximum junction temerature.
Absolute maximum ratings are the parameter values or ranges that can cause permanent damage if exceeded. For
maximum safe operating conditions, refer to Electrical Characteristics in Section 7. (TA = 25°C, unless otherwise
noted). Proper design precautions must be made to ensure that the internal die junction temperature of the
iW1818 does not exceed 150°C. Otherwise permanent damage to the device may occur.
5 Absolute Maximum Ratings
6 Thermal Characteristics
Parameter
Symbol
Value
Units
Thermal Resistance Junction-to-Ambient (Note 1) (Dissipated power 0.9W)
θJA
80
°C/W
Thermal Resistance Junction-to-GND pin (pin 3) (Note 2)
(Dissipated power 0.9W)
ψJB
25
°C/W
Thermal Resistance Junction-to-Collector pin (Note 2)
(Dissipated power 0.9W)
ψJ-BJT
35
°C/W
Thermal Shutdown Threshold (Note 3)
TSD
150
°C
Thermal Shutdown Recovery (Note 3)
TSD-R
120
°C
Notes:
Note 1.
θJA is measured in a one-cubic-foot natural convection chamber.
Note 2.
ψJB [Psi Junction to Board] provides an estimation of the die junction temperature relative to the PCB [Board] surface
temperature. ψJ-BJT [Psi Junction to Collector pin] provides an estimation of the die junction temperature relative to the
collector pin [internal BJT Collector] surface temperature. ψJB is measured at the ground pin (pin 3) without using any
thermal adhesives. See Section 10.14 for more information.
Note 3.
These parameters are typical and they are guaranteed by design.



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