n

Portablememory

n

LCDmonitors

n

Diskdrives

n

PDAs

n

Digitalcameras

n

DVDs

n

Cellphones

n

Rechargeablebatterypacks

n

Batterychargers

n

Settopboxes

n

Industrialcontrollers

Solder Reflow Recommendations

Peak: 250 +0/-5 °C

230 °C or higher

PRE-HEATING ZONE

SOLDERING ZONE

HEATING TIME

180 °C

PEAK: 250 +0/-5 °C, 5 seconds

PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds

SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds

250

200

150

100

50

150 °C

90 ± 30 Seconds

30 ± 10 Seconds

Peak: 250 +0/-5 °C

230 °C or higher

PRE-HEATING ZONE

SOLDERING ZONE

HEATING TIME

180 °C

PEAK: 250 +0/-5 °C, 5 seconds

PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds

SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds

250

200

150

100

50

150 °C

90 ± 30 Seconds

30 ± 10 Seconds

Product Dimensions

Recommended Pad Layout

DIMENSIONS:

MM

(INCHES)

Thermal Derating Curve

120

110

100

90

80

-20

02040

AMBIENT TEMPERATURE (°C)

60

80

100

120

Construction & Material Content

OVERCOAT

Sn PLATING

CERAMIC SUBSTRATE

FUSE ELEMENT

Cu / Ni PLATING

PACKAGING: 5,000 pcs./reel

1.6 ± 0.1

(.063 ± .004)

0.3 ± 0.2

(.012 ± .008)

0.3 ± 0.2

(.012 ± .008)

0.35 ± 0.2

(.014 ± .008)

0.35 ± 0.2

(.014 ± .008)

0.45 ± 0.1

(.018 ± .004)

0.8 ± 0.1

(.031 ± .004)

0.7 to 0.9

(.028 to .035)

2.0 to 2.2

(.079 to .087)

0.8 to 1.0

(.031 to .039)

1.6 ± 0.1

(.063 ± .004)

0.3 ± 0.2

(.012 ± .008)

0.3 ± 0.2

(.012 ± .008)

0.35 ± 0.2

(.014 ± .008)

0.35 ± 0.2

(.014 ± .008)

0.45 ± 0.1

(.018 ± .004)

0.8 ± 0.1

(.031 ± .004)

0.7 to 0.9

(.028 to .035)

2.0 to 2.2

(.079 to .087)

0.8 to 1.0

(.031 to .039)

1.6 ± 0.1

(.063 ± .004)

0.3 ± 0.2

(.012 ± .008)

0.3 ± 0.2

(.012 ± .008)

0.35 ± 0.2

(.014 ± .008)

0.35 ± 0.2

(.014 ± .008)

0.45 ± 0.1

(.018 ± .004)

0.8 ± 0.1

(.031 ± .004)

0.7 to 0.9

(.028 to .035)

2.0 to 2.2

(.079 to .087)

0.8 to 1.0

(.031 to .039)

Specificationsaresubjecttochangewithoutnotice.

Thedevicecharacteristicsandparametersinthisdatasheetcananddovaryindifferentapplicationsandactualdeviceperformancemayvaryovertime.

Usersshouldverifyactualdeviceperformanceintheirspecificapplications.