6

http://www.stanfordmicro.com

Phone: (800) SMI-MMIC

522 Almanor Ave., Sunnyvale, CA 94085

Preliminary

EDS-101392 Rev A

SCA-3 DC-5GHz Cascadable MMIC Amplifier

Preliminary

Mounting Instructions

The data shown was taken on a 31 mil thick FR-4 board with

1 ounce of copper on both sides.

The board was mounted to a baseplate with 3 screws as

shown. The screws bring the top side copper temperature to

the same value as the baseplate.

1. Use 1 or 2 ounce copper, if possible.

2. Solder the copper pad on the backside of the device

package to the ground plane.

3. Use a large ground pad area with many plated through-

holes as shown.

4. If possible, use at least one screw no more than 0.2 inch

from the device package to provide a low thermal resistance

path to the baseplate of the package.

5. Thermal resistance from ground lead to screws is

2 deg. C/W.

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Part Number Ordering Information

Caution: ESD Sensitive

Appropriate precautions in handling, packaging and

testing devices must be observed.

PCB Pad Layout

Part Symbolization

The part will be symbolized with a “C3” designator on

the top surface of the package.

Outline Drawing