TPS54873

SLVS444 – OCTOBER 2002

www.ti.com

14

MECHANICAL DATA

PWP (R-PDSO-G**)

POWERPAD

 PLASTIC SMALL-OUTLINE

4073225/F10/98

0,50

0,75

0,25

0,15 NOM

Thermal Pad

(See Note D)

Gage Plane

28

24

7,70

7,90

20

6,40

6,60

9,60

9,80

6,60

6,20

11

0,19

4,50

4,30

10

0,15

20

A

1

0,30

1,20 MAX

16

14

5,10

4,90

PINS **

4,90

5,10

DIM

A MIN

A MAX

0,05

Seating Plane

0,65

0,10

M

0,10

0

°–8°

20 PINS SHOWN

NOTES:A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusions.

D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.

This pad is electrically and thermally connected to the backside of the die and possibly selected leads.

E. Falls within JEDEC MO-153

PowerPAD is a trademark of Texas Instruments.