5

LTC4440

4440i

PI FU CTIO S

SOT-23 Package

side circuitry. A low ESR ceramic bypass capacitor should

be tied between this pin and the GND pin (Pin 2).

GND (Pin 2): Chip Ground.

INP (Pin 3): Input Signal. TTL/CMOS compatible input

referenced to GND (Pin 2).

TS (Pin 4): Top (High Side) Source Connection.

Input Threshold Hysteresis

vs Temperature

Peak Driver (TG) Pull-Up Current

vs Temperature

TYPICAL PERFOR A CE CHARACTERISTICS

Output Driver Pull-Down

Resistance vs Temperature

Propagation Delay vs Temperature

TEMPERATURE (

°C)

–60

500

460

480

440

420

400

380

360

340

320

120

90

4440 G13

300

–30

30

060

TEMPERATURE (

°C)

–60

3.0

2.8

2.9

2.7

2.6

2.5

2.4

2.3

2.2

2.1

120

90

4440 G14

2.0

–30

30

060

BOOST – TS = 12V

BOOST – TS = 15V

TG (Pin 5): High Current Gate Driver Output (Top Gate).

This pin swings between TS and BOOST – 0.7V.

BOOST (Pin 6): High Side Bootstrapped Supply. An exter-

nal capacitor should be tied between this pin and TS

(Pin 4). Normally, a bootstrap diode is connected between

drop of the bootstrap diode.

TEMPERATURE (

°C)

–60

2.0

2.5

3.0

120

90

4440 G15

1.5

1.0

0

–30

30

060

0.5

BOOST – TS = 15V

BOOST – TS = 8V

BOOST – TS = 12V

TEMPERATURE (

°C)

–60

45

40

35

30

25

20

15

10

5

120

90

4440 G16

0

–30

30

060