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5802-DS02-R Datasheet(PDF) 32 Page - Broadcom Corporation.

Part # 5802-DS02-R
Description  Single-Chip Security Processor
PDF  50 Pages
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Manufacturer  BOARDCOM [Broadcom Corporation.]
Direct Link  http://www.broadcom.com
Logo BOARDCOM - Broadcom Corporation.

5802-DS02-R Datasheet(HTML) 32 Page - Broadcom Corporation.

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■ BCM5802
Production Specification
07/03/02
B roa dcom Co rpo rat ion
Page 24 Memory Structures
Document
5802-DS03-405-R
Context Buffer. This structure defines DH/RSA/DSA processing to be applied on a per key setup basis.
Table 9:
Diffie-Hellman Public Key Generation (X = gx mod N) Command Context
Table 10:
Diffie-Hellman Shared Secret Generation (K=Yx mod N) Command Context
MSB
LSB
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15
14 13 12 11 10 9
8
7
6
5
4
3
2
1
0
Operation Type
Diffie-Hellman Public Key Operation
(0x01)
Total Command Context Structure Length
Random Number x Length
x provided by SW/x generated by RNG
Modulus N Length
Base g Length
Modulus N (512, 768, 1024 bits, lowest word)
Modulus N (512, 768, 1024 bits, 2nd lowest word)
……
Modulus N (512, 768, 1024 bits, highest word)
Base g (512, 768, 1024 bits, lowest word of key)
Base g (512, 768, 1024 bits, 2nd lowest word of key)
……
Base g (512, 768, 1024 bits, highest word of key)
MSB
LSB
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15
14 13 12 11 10 9
8
7
6
5
4
3
2
1
0
Operation Type
Diffie-Hellman Shared Secret
Generation Operation (0x02)
Total Command Context Structure Length
Modulus N Length
Exponent (private key) x Length
Modulus N (512, 768, 1024 bits, lowest word)
Modulus N (512, 768, 1024 bits, 2nd lowest word)
……
Modulus N (512, 768, 1024 bits, highest word)



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