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MSK0021 Datasheet(PDF) 3 Page - Anaren Microwave |
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MSK0021 Datasheet(HTML) 3 Page - Anaren Microwave |
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3 / 9 page ![]() HEAT SINKING To select the correct heat sink for your application, re- fertothethermalmodelandgoverningequationbelow. Thermal Model: APPLICATION NOTES CURRENT LIMIT The MSK0021 has an on-board current limit scheme designed to limit the output drivers anytime output current exceeds a predetermined limit.The following formula may be used to determine the value of the current limit resis- tancenecessarytoestablishthedesiredcurrentlimit. Current Limit Connection 3 RSC= 0.7 ISC ___ See "Application Circuits" in this data sheet for ad- ditionalinformationoncurrentlimitconnections. POWER SUPPLY BYPASSING Both the negative and the positive power supplies must be effectively decoupled with a high and low frequency bypass circuittoavoidpowersupplyinducedoscillation.Aneffective decouplingschemeconsistsofa0.1microfaradceramicca- pacitorinparallelwitha4.7microfaradtantalumcapacitorfrom eachpowersupplypintoground.Itisalsoagoodpracticewith high power op-amps, such as the MSK0021, to place a 30-50 microfarad capacitor with a low effective series resistance, in parallelwiththeothertwopowersupplydecouplingcapacitors. This capacitor will eliminate any peak output voltage clipping whichmayoccurduetopoorpowersupplyloadregulation. All power supply decoupling capacitors should be placed as closetothepackagepowersupplypinsaspossible. SAFE OPERATING AREA The safe operating area curve is a graphical representation ofthepowerhandlingcapabilityoftheamplifierundervarious conditions.Thewirebondcurrentcarryingcapability,transistor junction temperature and secondary breakdown limitations areallincorporatedintothesafeoperatingareacurves.All applicationsshouldbecheckedagainsttheS.O.A.curvesto ensurehighM.T.B.F. Governing Equation: TJ = PD X (RθJC + RθCS + RθSA) + TA Where TJ = Junction Temperature PD = Total Power Dissipation RθJC = Junction to Case Thermal Resistance RθCS = Case to Heat Sink Thermal Resistance RθSA = Heat Sink to Ambient Thermal Resistance TC = Case Temperature TA = Ambient Temperature TS = Sink Temperature Example: (TO-3 PACKAGE) Inourexampletheamplifierapplicationrequirestheoutputtodrivea 10voltpeaksinewaveacrossa10ohmloadfor1ampofoutputcurrent. For a worst case analysis we will treat the 1 amp peak output current asaD.C.outputcurrent.Thepowersuppliesare±15VDC. 1.) FindPowerDissipation PD=[(quiescent current) X (+VCC- (-VCC))] + [(VS - VO) X IOUT] =(3.5mA)X(30V)+(5V)X(1A) =0.1W+5W =5.1W 2.) Forconservativedesign,setTJ=+125°C. 3.) Forthisexample,worstcaseTA=+25°C. 4.) RθJC=2.0°C/WtypicallyfortheTO-3package. 5.)RearrangegoverningequationtosolveforRθSA: RθSA = (TJ - TA)/PD - (RθJC) - (RθCS) =(125°C-25°C)/5.1W-(2.0°C/W)-(0.15°C/W) =17.5°C/W The heat sink in this example must have a thermal resistance of no morethan17.5°C/Wtomaintainajunctiontemperatureoflessthan +125°C. 8548-83Rev.E9/15 |
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