For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106

Phone: 781-329-4700 • Order online at www.analog.com

Application Support: Phone: 1-800-ANALOG-D

5

HMC263LP4E

v02.1017

GaAs MMIC LOW NOISE

AMPLIFIER, 24 - 36 GHz

Outline Drawing

part Number

package Body material

lead finish

msl rating

HmC263lp4e

roHs-compliant low stress injection molded plastic

100% matte sn

msl3

[2]

H263

XXXX

[1] 4-Digit lot number XXXX

[2] max peak reflow temperature of 260 °C

Package Information

Absolute Maximum Ratings

Drain Bias Voltage (Vdd1, Vdd2)

+5.5 Vdc

rf input power (rfiN)(Vdd = +3 Vdc)

-5 dBm

Channel Temperature

175 °C

Continuous pdiss (T = 85 °C)

(derate 7.7 mw/°C above 85 °C)

0.7 w

Thermal resistance

(channel to ground paddle)

130 °C/w

storage Temperature

-65 to +150 °C

operating Temperature

-40 to +85 °C

eleCTrosTATiC seNsiTiVe DeViCe

oBserVe HANDliNG preCAUTioNs

0.50

BSC

0.50

0.40

0.30

COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-8.

24-Lead Lead Frame Chip Scale Package [LFCSP]

4 x 4 mm Body and 0.85 mm Package Height

(CP-24-16)

Dimensions shown in millimeters

BOTTOM VIEW

TOP VIEW

4.10

4.00 SQ

3.90

0.90

0.85

0.80

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

PIN 1

INDICATOR

1

24

7

12

13

18

19

6

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.30

0.25

0.18

0.20 MIN

2.85

2.70 SQ

2.55

EXPOSED

PAD

SEATING

PLANE

PIN 1

INDICATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

24-lead lead frame Chip scale package [lfCsp]

4 mm × 4 mm Body and 0.85 mm package Height

(Cp-24-16)

Dimensions shown in millimeters.