For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106

Phone: 781-329-4700 • Order online at www.analog.com

Application Support: Phone: 1-800-ANALOG-D

7

7 - 5

Part Number

Package Body Material

Lead Finish

MSL Rating

HMC463LP5

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

H463

XXXX

HMC463LP5E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

H463

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information

HMC463LP5 / 463LP5E

v09.0717

GaAs pHEMT MMIC LOW NOISE

AGC AMPLIFIER, 2 - 20 GHz

Outline Drawing

32-Lead Lead Frame Chip Scale Package [LFCSP]

5 x 5 mm Body and 0.90 mm Package Height

(HCP-32-1)

Dimensions shown in millimeters

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

32

9

16

17

24

25

8

EXPOSED

PAD

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.90

0.85

0.80

0.45

0.40

0.35

0.20 MIN

3.80

3.70 SQ

3.60

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-4.

3.50 REF

PIN 1

INDICATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

32-Lead Lead Frame Chip Scale Package [LFCSP]

5 mm × 5 mm Body and 0.90 mm Package Height

(HCP-32-1)

Dimensions shown in millimeters