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LSGA671 Datasheet(PDF) 11 Page - OSRAM GmbH |
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LSGA671 Datasheet(HTML) 11 Page - OSRAM GmbH |
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11 / 15 page  LSG A671 2009-01-12 11 Empfohlenes Lötpaddesign 8) Seite 15 Wellenlöten (TTW) Recommended Solder Pad 8) page 15 TTW Soldering Empfohlenes Lötpaddesign 8) Seite 15 Reflow Löten Recommended Solder Pad 8) page 15 Reflow Soldering OHPY1302 4.2 (0.165) 1.7 (0.067) Solder resist Padgeometrie für Paddesign for improved heat dissipation verbesserte Wärmeableitung Pick up Area Lötstopplack Cu Fläche Cu-area > 16 mm per pad 2 3.7 (0.146) 1.2 (0.047) Cu-area > 16 mm Cu-Fläche > 16 mm Paddesign for improved heat dissipation Wärmeableitung für verbesserte Padgeometrie Lötstopplack Solder resist OHLPY965 2 2 |
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