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SIT5021 Datasheet(PDF) 2 Page - SiTime Corp. |
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SIT5021 Datasheet(HTML) 2 Page - SiTime Corp. |
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2 / 13 page ![]() The Smart Timing Choice The Smart Timing Choice SiT5021 1-220 MHz High Performance Differential (VC) TCXO Rev. 1.5 Page 2 of 8 www.sitime.com Electrical Characteristics (continued) Parameter and Conditions Symbol Min. Typ. Max. Unit Condition LVDS, DC and AC Characteristics Current Consumption Idd – 47 55 mA Excluding Load Termination Current, Vdd = 3.3V or 2.5V OE Disable Supply Current I_OE – – 35 mA OE = Low Differential Output Voltage VOD 250 350 450 mV See Figure 2 Output Disable Leakage Current I_leak – – 1 AOE = Low Standby Current I_std – – 100 A ST = Low, for all Vdds VOD Magnitude Change VOD – – 50 mV See Figure 2 Offset Voltage VOS 1.125 1.2 1.375 V See Figure 2 VOS Magnitude Change VOS – – 50 mV See Figure 2 Rise/Fall Time Tr, Tf – 495 600 ps 20% to 80%, see Figure 2 OE Enable/Disable Time T_oe – – 115 ns f = 212.5 MHz - For other frequencies, T_oe = 100ns + 3 period RMS Period Jitter T_jitt – 1.2 1.7 ps f = 100 MHz, VDD = 3.3V or 2.5V – 1.2 1.7 ps f = 156.25 MHz, VDD = 3.3V or 2.5V – 1.2 1.7 ps f = 212.5 MHz, VDD = 3.3V or 2.5V RMS Phase Jitter (random) T_phj – 0.6 0.85 ps f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz, all Vdds Pin Description Pin Map Functionality 1 VC/OE/ST V Control Voltage control Output Enable H or Open: specified frequency output L: output is high impedance Standby H or Open: specified frequency output L: Device goes to sleep mode. Supply current reduces to I_std. 2 NC NA No Connect; Leave it floating or connect to GND for better heat dissipation 3 GND Power VDD Power Supply Ground 4 OUT+ Output Oscillator output 5 OUT- Output Complementary oscillator output 6 VDD Power Power supply voltage Absolute Maximum Attempted operation outside the absolute maximum ratings may cause permanent damage to the part. Actual performance of the IC is only guaranteed within the operational specifications, not at absolute maximum ratings. Parameter Min. Max. Unit Storage Temperature -65 150 °C VDD -0.5 4 V Electrostatic Discharge (HBM) –2000 V Soldering Temperature (follow standard Pb free soldering guidelines) – 260 °C Thermal Consideration Package JA, 4 Layer Board (°C/W) JC, Bottom (°C/W) 7050, 6-pin 142 27 5032, 6-pin 97 20 3225, 6-pin 109 20 Environmental Compliance Parameter Condition/Test Method Mechanical Shock MIL-STD-883F, Method 2002 Mechanical Vibration MIL-STD-883F, Method 2007 Temperature Cycle JESD22, Method A104 Solderability MIL-STD-883F, Method 2003 Moisture Sensitivity Level MSL1 @ 260°C 4 3 1 6 GND VDD OUT+ 5 2 NC OUT- VC/OE/ST Top View |
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