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LBT68C Datasheet(PDF) 11 Page - OSRAM GmbH |
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LBT68C Datasheet(HTML) 11 Page - OSRAM GmbH |
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11 / 16 page  LB T68C, LT T68C 2006-10-04 11 Empfohlenes Lötpaddesign 8) 9) Seite 16 IR Reflow Löten Recommended Solder Pad 8) 9) page 16 IR Reflow Soldering Empfohlenes Lötpaddesign verwendbar für TOPLED ® und Power TOPLED® IR Reflow Löten 8) Seite 16 Recommended Solder Pad useable for TOPLED ® and Power TOPLED® IR Reflow Soldering 8) page 16 OHLPY970 2.6 (0.102) Cu-area > 16 mm Cu-Fläche > 16 mm 2 2 Solder resist Lötstopplack 2.6 (0.102) Padgeometrie für improved heat dissipation verbesserte Wärmeableitung Paddesign for OHLPY440 Padgeometrie für verbesserte Wärmeableitung improved heat dissipation Paddesign for Lötstoplack Solder resist 0.8 (0.031) 2.3 (0.091) 3.3 (0.130) Cu Fläche / 16 mm per pad 2 Cu-area _ < 3.3 (0.130) Kathode/ Cathode Anode Fläche darf elektrisch nicht beschaltet werden. Do not use this area for electrical contact. 0.7 (0.028) Fläche darf elektrisch nicht beschaltet werden. Do not use this area for electrical contact. |
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