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LPM9007 Datasheet(PDF) 2 Page - Lowpower Semiconductor inc |
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LPM9007 Datasheet(HTML) 2 Page - Lowpower Semiconductor inc |
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2 / 7 page ![]() LPM9007-01 May.-2013 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 2 of 7 Preliminary Datasheet LPM9007 Absolute Maximum Ratings Parameter Symbol Maximum Units Drain-Source Voltage VDS -30 V Gate-Source Voltage VGS ±12 V Continuous Drain Current A TA=25°C ID -4.2 A TA=70°C -3.5 Pulsed Drain Current B IDM -30 Power Dissipation A TA=25°C PD 1.4 W Junction and Storage Temperature Range TJ, TSTG -55 to 150 °C Thermal resistance ratings Parameter Symbol Typ. Max. Units Maximum Junction-to-Ambient RθJA 125 °C/W Electrical Characteristics Symbol Parameter Condition Min Typ. Max Units STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage ID=-250μA, VGS=0V -30 V IDSS Zero Gate Voltage Drain Current VDS=-24V, VGS=0V TJ=55°C -1 uA -5 IGSS Gate-Body leakage current VDS=0V, VGS=±12V ±100 nA VGS(th) Gate Threshold Voltage VDS=VGS ID=-250μA -0.7 -1 -1.3 V ID(ON) On state drain current VGS=-4.5V, VDS=-5V -25 A RDS(ON) Static Drain-Source On-Resistance VGS=-10V, ID=-4.2A (TJ=125°C) 42 50 mΩ 75 VGS=-4.5V, ID=-4A 53 65 mΩ VGS=-2.5V, ID=-1A 80 120 mΩ gFS Forward Transconductance VDS=-5V, ID=-5A 7 11 S VSD Diode Forward Voltage IS=-1A,VGS=0V -0.75 -1 V |
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