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MP20056 Datasheet(PDF) 3 Page - Monolithic Power Systems |
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MP20056 Datasheet(HTML) 3 Page - Monolithic Power Systems |
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3 / 15 page ![]() MP20056 – LOW-NOISE, HIGH-PSRR, 250mA LINEAR REGULATOR MP20056 Rev.1.1 www.MonolithicPower.com 3 12/17/2015 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2015 MPS. All Rights Reserved. TOP MARKING (MP20056GJ-25) ALA: product code of MP20056GJ-25; Y: year code; PACKAGE REFERENCE TOP VIEW GND EN IN IN 1 2 3 4 FB NC OUT OUT 8 7 6 5 EXPOSED PAD ON BACKSIDE CONNECT TO GND TOP VIEW IN GND EN 1 2 3 5 4 OUT FB QFN8 (2 x 2mm) TSOT23-5 ABSOLUTE MAXIMUM RATINGS (1) VIN, EN, FB to GND .......................-0.3V to +6V OUT to GND ...................... -0.5V to (VIN + 0.5V) Continuous Power Dissipation ......(TA=25°C) (2) QFN8 (2x2mm)................................................1.6W TSOT23-5 ..................................................... 0.57W Junction Temperature...............................150°C Storage Temperature Range ..... -65°C to 150°C Lead Temperature (Soldering, 10sec)...........260°C ESD SUSCEPTIBILITY (3) HBM (Human Body Mode).......................... 2kV MM (Machine Mode) ................................. 200V Recommended Operating Conditions (4) Supply Input Voltage.......................2.5V to 5.5V Enable Input Voltage .........................0V to 5.5V Operating Junction Temp. (TJ). -40°C to +125°C Thermal Resistance (5) θJA θJC QFN-8 (2mmx2mm) ................80 ...... 16 ... °C/W TSOT23-5 ..............................220 .... 110 .. °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) Devices are ESD sensitive. Handling precaution recommended. 4) The device is not guaranteed to function outside of its operating conditions. 5) Measured on JESD51-7, 4-layer PCB. |
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