MP6004 datasheet(3/23 Pages) MPS

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MP6004—PRIMARY-SIDE REGULATED FLYBACK/BUCK 80V DCDC CONVERTER

MP6004 Rev. 1.0

www.MonolithicPower.com

4/14/2015

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ABSOLUTE MAXIMUM RATINGS

(1)

VIN............................................-0.3 V to +100 V

SW ............................................-0.7 V to +180 V

FB1 .........................................-0.7 V to +6.5 V(2)

FB2 to VIN .................................-6.5 V to +0.3 V

All other pins ...........................-0.3 V to +6.5 V(3)

VCC sinking current............................. 1.5 mA(4)

FB1 sinking current............................... ±1 mA(2)

EN sinking current .................................. 1 mA(5)

Continuous power dissipation (TA = +25°C)

(6)

................................................................ 2.5 W

Junction temperature ................................150

°C

Lead temperature .....................................260

°C

Storage temperature................ -65

°C to +150°C

Recommended Operating Conditions

(7)

Supply voltage (VIN) ........................14 V to 80 V

Switching voltage (VSW) ............-0.5 V to +150 V

Maximum VCC sinking current ............ 1.2 mA(4)

Maximum FB1 sinking current ........... ±0.5 mA(2)

Maximum EN sinking current............... 0.5 mA(5)

Maximum switching frequency.............. 200 kHz

Maximum current limit................................... 3 A

Switching junction temp. (TJ). .. -40°C to +125°C

Thermal Resistance

(8)

θJA

θJC

QFN-14 (3mm x 3mm)........... 50....... 12 °C/W

NOTES:

1) Exceeding these ratings may damage the device.

2) Refer to the “Output Voltage Setting” section on page 18.

3) VCC and EN voltage can be pulled higher than this rating, but

the external pull-up current should be limited. Refer to “VCC

sinking current” and “EN sinking current” ratings to the left.

4) Refer to the “VCC Power Supply Setting” section on page 17..

5) Refer to the “EN Control Setting” section on page 17.

6) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation produces an excessive die temperature, causing

the regulator to go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

7) The device is not guaranteed to function outside of its

operating conditions.

8) Measured on JESD51-7, 4-layer PCB.

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