Data Sheet

ADL5534

Rev. B | Page 13 of 16

SOLDERING INFORMATION AND RECOMMENDED

PCB LAND PATTERN

Figure 23 shows the recommended land pattern for ADL5534.

To minimize thermal impedance, the exposed paddle on the

package underside should be soldered down to a ground plane.

If multiple ground layers exist, they should be stitched together

using vias. Pin 1 to Pin 4, Pin 6, Pin 9 to Pin 11, and Pin 14 to

Pin 15 can be left unconnected, or can be connected to ground.

Connecting these pins to ground improves device-to-device

isolation and slightly enhances thermal impedance. For more

information on land pattern design and layout, refer to the

AN-772 Application Note, A Design and Manufacturing Guide for

the Lead Frame Chip Scale Package (LFCSP).

4.8mm

2.4mm

3.1mm

0.8mm

0.2mm

Figure 23. Recommended Land Pattern