LTM4624 datasheet(20/26 Pages) LINER

20 / 26 page

LTM4624

4624fd

For more information www.linear.com/LTM4624

APPLICATIONS INFORMATION

Figure 19. Recommended PCB Layout

VIN

COUT

VOUT

4624 F19

GND

CIN

RFB

Safety Considerations

The LTM4624 modules do not provide galvanic isolation

from VIN to VOUT. There is no internal fuse. If required,

a slow blow fuse with a rating twice the maximum input

current needs to be provided to protect each unit from

catastrophic failure. The device does support thermal

shutdown and over current protection.

Layout Checklist/Example

The high integration of LTM4624 makes the PCB board

layoutverysimpleandeasy.However,tooptimizeitselectri-

cal and thermal performance, some layout considerations

are still necessary.

• Use large PCB copper areas for high current paths,

including VIN, GND and VOUT. It helps to minimize the

PCB conduction loss and thermal stress.

• Place high frequency ceramic input and output capaci-

tors next to the VIN, PGND and VOUT pins to minimize

high frequency noise.

• Place a dedicated power ground layer underneath the

unit.

• To minimize the via conduction loss and reduce module

thermal stress, use multiple vias for interconnection

between top layer and other power layers.

• Do not put via directly on the pad, unless they are

capped or plated over.

• Use a separated SGND ground copper area for com-

ponents connected to signal pins. Connect the SGND

to GND underneath the unit.

• Bring out test points on the signal pins for monitoring.

Figure19givesagoodexampleoftherecommendedlayout.

LTM4624 Datasheet(PDF) 20 Page - Linear Technology

LTM4624 Datasheet(HTML) 20 Page - Linear Technology

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