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LCW-W5AM Datasheet(PDF) 17 Page - OSRAM GmbH |
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LCW-W5AM Datasheet(HTML) 17 Page - OSRAM GmbH |
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17 / 23 page  LCW W5AM 2009-06-19 17 Empfohlenes Lötpaddesign 6) Seite 23 Reflow Löten Recommended Solder Pad 6) page 23 Reflow Soldering Solder resist Bare Copper Freies Kupfer Lötpasten Schablone Solder paste stencil Lötstopplack OHPY3637 Kupfer Copper 1.6 (0.063) 11.6 (0.457) 12.0 (0.472) 1.6 (0.063) 11.6 (0.457) 3 Lötstellen 3 solder points Thermal enhanced PCB Thermisch optimiertes PCB ø4.0 (0.157) Heatsink attach ø4.0 (0.157) ø2.5 (0.098) 1 (0.039) Achtung: Anode und Heatsink sind elektrisch verbunden Attention: Anode and Heatsink are electrically connected Footprint Empfohlene Padgeometrie Recommended Solder Pad Design |
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