Data Sheet

HMC1121

Rev. A | Page 13 of 15

EVALUATION BOARD

The HMC1121 evaluation printed circuit board (PCB) is a

2-layer board that was fabricated using a Rogers 4350 and best

practices for high frequency RF design. The RF input and RF

output traces have a 50 Ω characteristic impedance. The PCB is

attached to a heat sink by a SN96 solder, which provides a low

thermal resistance path. Components are mounted using SN63

solder, allowing rework of the surface-mount components

without compromising the circuit board to heat sink

attachment.

The evaluation PCB and populated components operate over

the −40°C to +85°C ambient temperature range. During operation,

attach the evaluation PCB to a temperature controlled plate to

control the temperature. For proper bias sequence, see the

Applications Information section.

See Figure 35 for the HMC1121 evaluation board schematic. A

fully populated and tested evaluation board, which is shown in

Figure 34, is available from Analog Devices, Inc., upon request.

Figure 34. HMC1121 Evaluation Board

BILL OF MATERIALS

Table 5.

Item

Description

J1, J2

PCB mount SMA RF connector, Johnson PN 142-07010851

J3, J4

DC pins

J5, J6

RF connectors for thru line; not populated

C1 to C8

100 pF capacitors, 0402 package

C9 to C16

10 nF capacitors, 0402 package

C17 to C24

4.7 μF capacitor, Case A

R1 to R4

20 Ω resistors, 0402 package

R5, R6

100 kΩ resistors, 0402 package

U1

HMC1121LP6GE

Heat sink

Used for thermal transfer from the HMC1121LP6GE amplifier

PCB

600-01061-00 evaluation board; circuit board material: Rogers 4350