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EL1881CSZ Datasheet(PDF) 2 Page - Renesas Technology Corp |
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EL1881CSZ Datasheet(HTML) 2 Page - Renesas Technology Corp |
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2 / 13 page ![]() EL1881 FN7018 Rev 2.00 Page 2 of 13 September 15, 2011 Pin Descriptions PIN NUMBER PIN NAME PIN FUNCTION 1 Composite Sync Out Composite sync pulse output; sync pulses start on a falling edge and end on a rising edge 2 Composite Video In AC coupled composite video input; sync tip must be at the lowest potential (positive picture phase) 3 Vertical Sync Out Vertical sync pulse output; the falling edge of vert sync is the start of the vertical period 4 GND Supply ground 5 Burst/Back Porch Output Burst/back porch output; low during burst portion of composite video 6RSET (Note 1) An external resistor to ground sets all internal timing; a 681k 1% resistor will provide correct timing for NTSC signals 7 Odd/Even Output Odd/even field output; high during odd fields, low during even fields; transitions occur at start of vert sync pulse 8 VDD 5V Positive supply (5V) NOTE: 1. RSET must be a 1% resistor Ordering Information PART NUMBER PART MARKING PACKAGE PKG. DWG. # EL1881CN EL1881CN 8 Ld PDIP E8.3 EL1881CS 1881CS 8 Ld SOIC M8.15E EL1881CS-T7 (Note 2) 1881CS 8 Ld SOIC (Tape & Reel) M8.15E EL1881CSZ (Notes 3, 4) 1881CSZ 8 Ld SOIC (Pb-free) M8.15E EL1881CSZ-T7 (Notes 2, 3, 4) 1881CSZ 8 Ld SOIC (Pb-free, Tape & Reel) M8.15E EL1881CSZ-T13 (Notes 2, 3, 4)) 1881CSZ 8 Ld SOIC (Pb-free, Tape & Reel) M8.15E NOTES: 2. Please refer to TB347 for details on reel specifications. 3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD- 020. 4. For Moisture Sensitivity Level (MSL), please see device information page for EL1881. For more information on MSL, please see Technical Brief TB363. |
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