HIN232ACBZ datasheet(3/10 Pages) RENESAS

3 / 10 page

HIN232A

FN4316 Rev 1.00

Page 3 of 10

March 13, 2006

Absolute Maximum Ratings

Thermal Information

VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) <VCC < 6V

V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . (VCC -0.3V) <V+ < 12V

V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)

Input Voltages

TIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < VIN < (V+ +0.3V)

RIN 30V

Output Voltages

TOUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V)

ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V)

Short Circuit Duration

TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous

ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous

ESD Classification . . . . . . . . . . . . . . . . . . . . See Specification Table

Thermal Resistance (Typical, Note 1)

JA (oC/W)

16 Ld SOIC (N) Package . . . . . . . . . . . . . . . . . . . . .

105

16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . .

110

16 Ld PDIP Package* . . . . . . . . . . . . . . . . . . . . . . .

Maximum Junction Temperature (Plastic Package) . . . . . .150oC

Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC

(SOIC - Lead Tips Only)

*Pb-free PDIPs can be used for through hole wave solder processing

only. They are not intended for use in Reflow solder processing

applications.

Operating Conditions

Temperature Range

HIN232ACX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:

JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

Electrical Specifications

Test Conditions: VCC = +5V 10%, C1-C4 = 0.1F; TA = Operating Temperature Range

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

SUPPLY CURRENTS

Power Supply Current, ICC

No Load, TA = 25oC-

LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS

Input Logic Low, VlL

TIN

0.8

Input Logic High, VlH

TIN

2.0

Transmitter Input Pullup Current, IP

TIN = 0V

200

A

TTL/CMOS Receiver Output Voltage Low, VOL

IOUT = 3.2mA

0.1

0.4

TTL/CMOS Receiver Output Voltage High, VOH

IOUT = -1mA

3.5

4.6

RECEIVER INPUTS

RS-232 Input Voltage Range, VIN

-30

+30

Receiver Input Impedance, RIN

VIN = 3V, TA = 25oC

3.0

5.0

7.0



Receiver Input Low Threshold, VIN (H-L)

VCC = 5V, TA = 25oC-

1.2

Receiver Input High Threshold, VIN (L-H)

VCC = 5V, TA = 25oC-

1.7

2.4

Receiver Input Hysteresis, VHYST

VCC = 5V

0.2

0.5

1.0

TIMING CHARACTERISTICS

Transmitter, Receiver Propagation Delay, tPD

-0.5

s

Transition Region Slew Rate, SRT

RL = 3k, CL = 1000pF, Measured from +3V to

-3V or -3V to +3V, (Note 2) 1 Transmitter Switching

320

s

TRANSMITTER OUTPUTS

Output Voltage Swing, TOUT

Transmitter Outputs, 3k

 to Ground

5

9

10

Output Resistance, TOUT

VCC = V+ = V- = 0V, VOUT = 2V

300



RS-232 Output Short Circuit Current, ISC

TOUT Shorted to GND

10

ESD PERFORMANCE

RS-232 Pins

(TOUT, RIN)

Human Body Model

15

IEC1000-4-2 Contact Discharge

8-

IEC1000-4-2 Air Gap (Note 3)

15

All Other Pins

Human Body Model

2-

NOTES:

2. Guaranteed by design.

3. Meets level 4.

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