DN2470

Rev. 1

011105

2

Thermal Characteristics

Package

Power Dissipation

θ

JC

°C/W

θ

JA

°C/W

TO-252

170mA

500mA

2.5W**

6.25

50**

170mA

500mA

** Mounted on FR4, 25mm x 25mm x 1.57mm

Symbol

Parameter

Min

Typ

Max

Units

Conditions

Drain-to-Source

Breakdown Voltage

700

V

Gate-to-Source OFF Voltage

-1.5

-3.5

V

∆V

GS(OFF)

4.5

mV/°C

Gate Body Leakage

100

nA

1.0

µA

Drain-to-Source Leakage Current

1.0

mA

Saturated Drain-to-source Current

500

mA

Static Drain-to-Source ON-State Resistance

42

Ω

∆R

DS(ON)

1.1

%/°C

Forward Transconductance

100

mmho

Input Capacitance

540

Common Source Output Capacitance

60

Reverse Transfer Capacitance

25

pF

f=1MHz

Turn-ON Delay Time

30

Rise Time

45

Turn-Off Delay Time

45

Fall Time

60

ns

Diode Forward Voltage Drop

1.8

V

Reverse Recovery Time

800

ns

Notes:

1) All DC parameters 100% tested at 25°C unless otherwise stated. (Pulsed test: 300µs pulse at 2% duty cycle.)

2) All AC parameters sample tested.

Switching Waveforms and Test Circuit

Input

Pulse

Generator

D.U.T

OUTPUT

0V

-10V

V

DD

t

d(OFF)

Input

Output

t

r

t

f

t

d(ON)

t

(ON)

t

(OFF)

10%

90%

90%

10%

90%

10%

0V

Doc# DSFP-DN2470

NR011905