ISL55211

FN7868 Rev 0.00

Page 2 of 20

June 21, 2011

Pin Configuration

ISL55211

(3x3 16 LD TQFN)

TOP VIEW

GND

NC

NC

GND

GND

1

2

3

4

56

78

9

10

11

12

13

14

15

16

+

-

GND

GND

500

Pd

0.2pF

0.2pF

750

750

500

140

348

348

140

Pin Descriptions

PIN NUMBER

SYMBOL

DESCRIPTION

5, 8, 13, 16

GND

Supply Ground (thermal pad electrically connected)

6, 15

Positive Power Supply (3.0V~4.2V)

7

Pd

Power-down: Pd = logic low. Puts part into low power mode; Pd = logic high or open for normal operation

Inverting Amplifier Output

10, 11

NC

No Internal Connection

12

Non-Inverting Amplifier Output

14

Common-mode Voltage Input

Ordering Information

PART NUMBER

(Notes 1, 2, 3)

PART MARKING

TEMP RANGE

(°C)

PACKAGE

(Pb-free)

PKG.

DWG. #

ISL55211IRTZ

5211

-40 to +85

16 Ld 3x3 TQFN

L16.3x3D

ISL55211IRTZ-EVAL1Z

Evaluation Board

NOTES:

1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.

2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte

tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil

Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

3. For Moisture Sensitivity Level (MSL), please see device information page for ISL55211. For more information on MSL please see techbrief TB363.