©2012 Fairchild Semiconductor Corporation

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FSB50760SFS Rev. 1.1

Detailed Package Outline Drawings (FSB50760SFS)

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or data on the drawing and contact a FairchildSemiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide therm and conditions,

specifically the the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/dwg/MO/MOD23DG.pdf