Features

For surface mounted application

Glass passivated junction chip.

Low forward voltage drop

High current capability

Easy pick and place

High surge current capability

Plastic material used carries Underwriters

Laboratory Classification 94V-0

High temperature soldering:

260

Mechanical Data

Case: Molded plastic

Terminals: Pure tin plated, lead free.

Polarity: Indicated by cathode band

Packaging: 16mm tape per EIA STD RS-481

Weight: 0.062 gram approximately

Maximum Ratings and Electrical Characteristics

Single phase, half wave, 60 Hz, resistive or inductive load.

For capacitive load, derate current by 20%

Type Number

Symbol

Units

Maximum Recurrent Peak Reverse Voltage

50

100

200

400

600

800

1000

V

Maximum RMS Voltage

35

70

140

280

420

560

700

V

Maximum DC Blocking Voltage

50

100

200

400

600

800

1000

V

Maximum Average Forward Rectified Current

3.0

A

Peak Forward Surge Current, 8.3 ms Single

Half Sine-wave Superimposed on Rated

Load (JEDEC method )

100

A

Maximum Instantaneous Forward Voltage

@ 3.0A

5

100

uA

uA

Maximum Reverse Recovery Time ( Note 1 )

Trr

2.5

uS

Typical Junction Capacitance ( Note 2 )

Cj

40

pF

Typical Thermal Resistance (Note 3)

30

Operating Temperature Range

-55 to +150

Storage Temperature Range

-55 to +150

Notes:

3. Measured on P.C. Board with 0.4” x 0.4” (10mm x 10mm) Copper Pad Areas.

SMBF

Unit: inch (mm)

S3ABF thru S3MBF

Pb Free Plating Product

S3ABF thru S3MBF

3.0 Amperes Surface Mount Miniature Glass Passivated Standard Rectifier

Pb

© 1995 Thinki Semiconductor Co., Ltd.

http://www.thinkisemi.com.tw/

Page 1/2

Rev.08T

Cathode Band

Top View

0.165(4.2)

0.173(4.4)

0.216(5.5)

0.200(5.1)

0.146(3.70)

0.138(3.50)

0.075(1.90)

0.086(2.20)

0.051(1.30)

0.043(1.10)

0.010(0.26)

0.0071(0.18)

0.051(1.30)

0.039(1.0)

S3ABF S3BBF S3DBF S3GBF S3JBF S3KBF S3MBF

1.10

V