© 2005 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSA2267 / FSA2267A Rev. 1.0.5

12

Physical Dimensions

Figure 18. 10-Lead, MicroPak™, 1.6 x 2.1mm

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in

any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor

representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairch-

ild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.

For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:

http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf.

BOTTOM VIEW

TOP VIEW

RECOMMENDED LAND PATTERN

SIDE VIEW

2X

2X

NOTES:

A. PACKAGE CONFORMS TO JEDEC

REGISTRATION MO-255, VARIATION UABD

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

D. PRESENCE OF CENTER PAD IS PACKAGE

SUPPLIER DEPENDENT. IF PRESENT

IS NOT INTENDED TO BE SOLDERED A

HAS A BLACK OXIDE FINISH.

E. DRAWING FILENAME: MKT-MAC10Arev5.

0.10 C

0.10

CA B

0.05

C

IDENT IS

ER THAN

ER LINES

B

C

0.35

0.25

9X

9X

1

4

9

6

0.25

0.15

10

5

0.50

0.56

1.62

0.05

0.00

0.05 C

0.55 MAX

0.05 C

1.60

(0.35)

(0.25)

0.50

10X

10X

(0.11)

1.12

1.62

KEEPOUT ZONE, N

OR VIAS ALLOWED

(0.20)

(0.15)

0.35

0.25

0.35

0.25

AIL A

DETAIL A 2X SCALE

0.35

0.25

0.65

0.55

D

ALL FEATURES

(0.36)

(0.29)

0.56