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FUSB302BMPX Datasheet(PDF) 17 Page - ON Semiconductor |
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FUSB302BMPX Datasheet(HTML) 17 Page - ON Semiconductor |
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17 / 32 page  FUSB302B www.onsemi.com 17 Table 13. IO SPECIFICATIONS Symbol Unit TA = −40 to +855C TA = −40 to +1055C (Note 11) TJ = −40 to +1255C Conditions VDD (V) Parameter Symbol Unit Max Typ Min Conditions VDD (V) Parameter I2C INTERFACE PINS – STANDARD, FAST, OR FAST MODE PLUS SPEED MODE (SDA, SCL) (Note 6) VHYS Hysteresis of Schmitt Trigger Inputs 3.0 to 5.5 94 − − mV II2C Input Current of SDA and SCL Pins 3.0 to 5.5 Input Voltage 0.26 V to 2 .0 V −10 − 10 mA ICCTI2C VDD Current when SDA or SCL is HIGH 3.0 to 5.5 Input Voltage 1.8 V −10 − 10 mA VOLSDA Low-Level Output Voltage (Open-Drain) 3.0 to 5.5 IOL = 2 mA 0 − 0.35 V IOLSDA Low-Level Output Current (Open-Drain) 3.0 to 5.5 VOLSDA = 0.4 V 20 − − mA CI Capacitance for Each I/O Pin (Note 7) 3.0 to 5.5 − 5 − pF 6. I2C pull up voltage is required to be between 1.71 V and VDD. Table 14. I2C SPECIFICATIONS FAST MODE PLUS I2C SPECIFICATIONS Symbol Parameter Fast Mode Plus Unit Min Max fSCL I2C_SCL Clock Frequency 0 1000 kHz tHD;STA Hold Time (Repeated) START Condition 0. 26 − ms tLOW Low Period of I2C_SCL Clock 0.5 − ms tHIGH High Period of I2C_SCL Clock 0.26 − ms tSU;STA Set-up Time for Repeated START Condition 0.26 − ms tHD;DAT Data Hold Time 0 − ms tSU;DAT Data Set-up Time 50 − ns tr Rise Time of I2C_SDA and I2C_SCL Signals (Note 7) − 120 ns tf Fall Time of I2C_SDA and I2C_SCL Signals (Note 7) 6 120 ns tSU;STO Set−up Time for STOP Condition 0.26 − ms tBUF Bus-Free Time between STOP and START Conditions (Note 7) 0.5 − ms tSP Pulse Width of Spikes that Must Be Suppressed by the Input Filter 0 50 ns Cb Capacitive Load for each Bus Line (Note 7) − 550 pF tVD−DAT Data Valid Time for Data from SCL LOW to SDA HIGH or LOW Output (Note 7) 0 0.45 ms tVD−ACK Data Valid Time for acknowledge from SCL LOW to SDA HIGH or LOW Output (Note 7) 0 0.45 ms VnL Noise Margin at the LOW Level (Note 7) 0.2 − V VnH Noise Margin at the HIGH Level (Note 7) 0.4 − V 7. Guaranteed by Characterization and/or Design. Not production tested . |
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