THS3122

THS3125

SLOS382 − SEPTEMBER 2001

2

www.ti.com

AVAILABLE OPTIONS

PACKAGED DEVICE

EVALUATION

TA

SOIC-8

(D)

SOIC-8 PowerPAD

(DDA)

SOIC-14

(D)

TSSOP-14

(PWP)

EVALUATION

MODULES

0

°C to 70°C

THS3122CD

THS3122CDDA

THS3125CD

THS3125CPWP

THS3122EVM

−40

°C to 85°C

THS3122ID

THS3122IDDA

THS3125ID

THS3125IPWP

THS3122EVM

THS3125EVM

33 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output current (see Note 1)

275 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Differential input voltage

± 4 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Maximum junction temperature

150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Total power dissipation at (or below) 25

°C free-air temperature

See Dissipation Ratings Table

. . . . . . . . . . .

0

°C to 70°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Industrial

−40

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Industrial

−65

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: The THS3122 and THS3125 may incorporate a PowerPAD

 on the underside of the chip. This acts as a heatsink and must be

connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction

temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the

PowerPAD

DISSIPATION RATING TABLE

PACKAGE

θJA

TA = 25°C

POWER RATING

D-8

95

°C/W‡

1.32 W

DDA

67

°C/W

1.87 W

D-14

66.6

°C/W‡

1.88 W

PWP

37.5

°C/W

3.3 W

‡ This data was taken using the JEDEC proposed high-K test PCB.

For the JEDEC low-K test PCB, the

θJA is168°C/W for the D-8

package and 122.3

°C/W for the D-14 package.

recommended operating conditions

MIN

NOM

MAX

UNIT

Supply voltage, VCC+ to VCC−

Dual supply

±5

±15

V

Supply voltage, VCC+ to VCC−

Single supply

10

30

V

Operating free-air temperature, TA

C-suffix

0

70

°C

Operating free-air temperature, TA

I-suffix

−40

85

°C

Shutdown pin input levels, relative to the GND pin

High level (device shutdown)

2

V

Shutdown pin input levels, relative to the GND pin

Low level (device active)

0.8

V