4

/5

SMB 600W Series

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications

www.bencent.com.cn

Version: A2 2016-05-27

Transient Voltage Suppressor

Reflow Condition

Pb-Free Assembly

Pre Heat

Temperature Min.

+150°C

Temperature Max.

+200°C

Time(Min to Max)

60 – 180 secs.

Average ramp up rate(Liquidus

3°C/sec. Max.

3°C/sec. Max.

Reflow

(Liquidus)

+217°C

60 – 150 secs.

+(260+0/-5 )°C

Time within 5°C of actual Peak Temp

30 secs.

Ramp-down Rate

6°C/sec. Max.

8 min. Max.

Do not exceed

+260°C

REF.

mm

inch

A

1.85--2.15

0.073--0.085

B

3.45--3.75

0.138--0.148

C

4.35--4.65

0.171--0.183

D

2.10--2.60

0.083--0.102

E

0.15--0.25

0.006--0.010

F

0.80--1.50

0.031--0.059

G

0.00--0.40

0.000--0.016

H

4.95--5.45

0.195--0.215

REF

mm

inch

A

5.45

0.215

B

2.45

0.097

C

2.15

0.085

Reflow Profile

Product Dimensions

Recommended Soldering Pad

25

time to peak temperature

Time

Critical Zone

Ramp-up

Preheat

Ramp-down