15 A Low-Side RF MOSFET Driver

IXRFDSM607X2

8

Fig. 24 Footprint and PCB layout

For optimum results, multiple pins of the same type should be grouped together on the PCB as shown below. This as-

sures wide traces to the attached driver and load, minimizing parasitic inductance. For best operation, the ground lead

groups are ideally incorporated into a large contiguous ground plane on the same side of mounting on the circuit board.

In other words, instead of routing ground traces to the device during layout, the footprint is set over a large ground plane

with drain and gate traces routed out of the ground plane. This is done during layout by first establishing a polygon that

covers the entire PCB, representing the ground plane, that is ‘poured’ around needed traces by the layout software.

inch/mm

Grouped pins

on Vcc and

input side

Grouped pins on GND

and output side