LX1732 datasheet(2/12 Pages) MICROSEMI

2 / 12 page

Microsemi

Integrated Products

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570

Page 2

Rev. 1.1c, 2005-03-03

LX1732

High Current PFM Boost Converter

PRODUCTION DATA SHEET

I N T E GRA T ED

PR ODUC T S

ABSOLUTE MAXI MUM RATI NGS

Supply Voltage (VIN) ........................................................................-0.3V to 7.0V

Output Voltage (VC) .........................................................................-0.3V to 7.0V

Switch Voltage (VSW) .......................................................................-0.3V to 7.0V

Shutdown Input Voltage (V

SHDN ) ......................................... -0.3V to (VC + 0.3V)

Low Battery Detect Output (VLBO) ...................................... -0.3V to (VC + 0.3V)

Low Battery Detect Input Voltage (VLBI) .............................. -0.3V to (VC+ 0.3V)

Feedback Input Voltage (VFB) ............................................... -0.3V to (VC+ 0.3V)

Switch Current (ILX).................................................................................. 1.0ARMS

Operating Temperature Range ............................................................ 0°C to 70°C

Operating Junction Temperature.................................................................. 150°C

Storage Temperature Range...........................................................-65°C to 150°C

Peak Package Temp for Solder Reflow (40 second max. exposure) ............. 260°C (+0, -5)

Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to

Ground. Currents are positive into, negative out of specified terminal

TH ERM A L DATA

DU Plastic MSOP 8-Pin

THERMAL RESISTANCE

-JUNCTION TO AMBIENT,

θJA

206

°C/W

THERMAL RESISTANCE

-JUNCTION TO CASE,

θJC

°C/W

Junction Temperature Calculation: TJ = TA + (PD x θJC).

The θJA numbers are guidelines for the thermal performance of the device/pc-board

system. All of the above assume no ambient airflow.

PACKAGE PIN OUT

LBI

VIN

GND

LBO

SHDN

DU PACKAGE

(Top View)

RoHS / Pb-free 100% Matte Tin Lead Finish

FUNCTIONAL PIN DESCRIPTION

NAME

DESCRIPTION

Unregulated IC Supply Voltage Input – Input range from +1.1V to 5.5V. Bypass with a 4.7

µF or greater capacitor.

Control pin for output voltage programming. Connect this pin to a resistive divider network between the output

and GND to obtain an output voltage between 2.0V and 5.5V.

SHDN

Active-Low Shutdown Input – A logic low shuts down the device and reduces the supply current to 0.1

µA.

Connect SHDN to VCC for normal operation.

Inductor Switching Connection – Internally connected to the drain of an N-channel MOSFET.

Output voltage control pin: Connect this pin to the circuit load and cathode of the switching diode.

GND

Common terminal for ground reference.

LBI

Low Battery Detect Comparator Input – Connect to a resistive divider network between the VCC and GND to set

the Low Battery Detect trip point. The LBI threshold is 0.6V.

LBO

Low Battery Detect Comparator Output – Open drain comparator output. This output is pulled low when VLBI is

less than 0.6V. LBO is high impedance during shutdown.

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