AD5669RBCBZ-1-R5 datasheet(29/30 Pages) AD

29 / 30 page

Data Sheet

AD5629R/AD5669R

Rev. F | Page 29 of 30

OUTLINE DIMENSIONS

2.70

2.60 SQ

2.50

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGC.

0.65

BSC

4.10

4.00 SQ

3.90

0.45

0.40

0.35

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

0.20 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

0.35

0.30

0.25

BOTTOM VIEW

SEATING

PLANE

TOP VIEW

SIDE VIEW

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

EXPOSED

PAD

Figure 56. 16-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body, 0.75 mm Package Height

(CP-16-17)

Dimensions shown in millimeters

PIN 1

SEATING

PLANE

8°

0°

4.50

4.40

4.30

6.40

BSC

5.10

5.00

4.90

0.65

BSC

0.15

0.05

1.20

MAX

0.20

0.09

0.75

0.60

0.45

0.30

0.19

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB

Figure 57. 16-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeters

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