Philips Semiconductors

2N7002F

TrenchMOS™ Logic Level FET

Product data

Rev. 01 — 11 February 2002

4 of 11

9397 750 09096

© Koninklijke Philips Electronics N.V. 2002. All rights reserved.

7.

Thermal characteristics

7.1 Transient thermal impedance

Table 4:

Thermal characteristics

Symbol Parameter

Conditions

Min Typ Max Unit

thermal resistance from junction to solder point mounted on a metal clad board; Figure 4

-

-

150

K/W

thermal resistance from junction to ambient

mounted on a printed circuit board;

minimum footprint

-

-

350

K/W

Mounted on metal clad substrate.

Fig 4.

Transient thermal impedance from junction to solder point as a function of pulse duration.

03ai09

10-1

1

10

102

103

10-5

10-4

10-3

10-2

10-1

1

10

tp (s)

Zth(j-sp)

K/W

single pulse

0.2

0.1

0.05

0.02

δ = 0.5

tp

tp

T

P

t

T