3A Bus Termination Regulator
Rev. A.8 - Oct., 2003
HPL5331
1
Copyright HIPAC Semiconductor, Inc.
www.hipacsemi.com
•••••
Provide Bi-direction Current
- Sourcing or Sinking Current up to 3A
•••••
1.25V/0.9V Output for DDR I/II Applications
•••••
Fast Transient Response
•••••
High Output Accuracy
- ±20mV over Load, VOUT Offset and
Temperature
•••••
Adjustable Output Voltage by External Resistors
•••••
Current-Limit Protection
•••••
On-Chip Thermal Shutdown
•••••
Shutdown for Standby or Suspend Mode
•••••
Simple SOP-8, SOP-8-P with thermal pad,
TO-252- 5 and TO-263-5 Packages
Features
General Description (Cont.)
On-chip thermal shutdown provides protection against
any combination of overload that would create ex-
cessive junction temperature. The output voltage of
HPL5331 track the voltage at VREF pin. A resistor
divider connected to VIN, GND and VREF pins is
used to provide a half voltage of VIN to VREF pin. In
addition, an external ceramic capacitor and an open-
drain transistor connected to VREF pin provides soft-
start and shutdown control respectively. Pulling and
holding the VREF to GND shuts off the output. The
output of HPL5331 will be high impedance after being
shut down by VREF or thermal shutdown function.
Applications
•
DDR I/II SDRAM Termination
•
SSTL-2/3 Termination Voltage
•
Applications Requiring the Regulator with
Bi-direction 3A Current Capability
Pin Configuration
TO-252-5 (Top View)
VOUT
VREF
VCNTL
GND
VIN
TAB is VCNTL
TO-263-5 (Top View)
VIN
GND
VCNTL
VREF
VOUT
1
2
3
4
5
TAB is VCNTL
SOP-8 (Top View)
1
2
3
45
6
7
8
VIN
GND
VREF
VOUT
VCNTL
VCNTL
VCNTL
VCNTL
General Description
The HPL5331 linear regulator is designed to provide a
regulated voltage with bi-directional output current for
DDR-SDRAM termination. The HPL5331 integrates
two power transistors to source or sink current up to
3A. It also incorporate current-limit, thermal shutdown
and shutdown control functions into a single chip. Cur-
rent-limit circuit limits the short-circuit current.
1
2
3
45
6
7
8
VIN
GND
VREF
VOUT
NC
VCNTL
NC
NC
SOP-8-P (Top View)
= Thermal Pad
NC = No internal connection
(connected to GND plane for better heat
dissipation)
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