TSSD10L60SW datasheet(2/6 Pages) TSC

2 / 6 page

TSSD10L45SW - TSSD10L60SW

Taiwan Semiconductor

Version:B1704

THERMAL PERFORMANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Junction-to-lead thermal resistance

RӨJL

°C/W

Junction-to-ambient thermal resistance

RӨJA

°C/W

Junction-to-case thermal resistance

RӨJC

°C/W

Thermal Performance Note: Units mounted on recommended PCB (16mm x 16mm Cu pad test board)

ELECTRICAL SPECIFICATIONS (T

A = 25°C unless otherwise noted)

PARAMETER

CONDITIONS

SYMBOL

TYP

MAX

UNIT

Forward voltage per diode

(1)

TSSD10L45SW

IF = 5A, TJ = 25°C

0.43

IF = 10A, TJ = 25°C

0.49

0.55

IF = 5A, TJ = 125°C

0.33

IF = 10A, TJ = 125°C

0.41

0.50

TSSD10L60SW

IF = 5A, TJ = 25°C

0.47

IF = 10A, TJ = 25°C

0.55

0.66

IF = 5A, TJ = 125°C

0.36

IF = 10A, TJ = 125°C

0.47

0.64

Reverse current @ rated VR per diode

(2)

TJ = 25°C

µA

TJ = 125°C

Junction capacitance

TSSD10L45SW

1 MHz, VR=4.0V

1290

TSSD10L60SW

1585

Notes:

Pulse test with PW=0.3 ms

Pulse test with PW=30 ms

ORDERING INFORMATION

PART NO.

PACKING

CODE

PACKING CODE

SUFFIX

PACKAGE

PACKING

TSSD10LxxSW

(Note 1, 2)

TO-252 (D-PAK)

2.5KPCS / 13"Reel

Notes:

1. "xx" defines voltage from 45V (TSSD10L45SW) to 60V (TSSD10L60SW)

2. Whole series with green compound (halogen-free)

EXAMPLE

EXAMPLE P/N

PART NO.

PACKING CODE

SUFFIX

DESCRIPTION

TSSD10L45SW ROG

TSSD10L45SW

Green compound

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