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STM32F030X4 Datasheet(PDF) 70 Page - STMicroelectronics

Part # STM32F030X4
Description  Value-line Arm®-based 32-bit MCU with up to 256 KB Flash, timers, ADC, communication interfaces, 2.4-3.6 V operation
PDF  93 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F030X4 Datasheet(HTML) 70 Page - STMicroelectronics

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Electrical characteristics
STM32F030x4/x6/x8/xC
70/93
DS9773 Rev 4
Figure 23. ADC accuracy characteristics
Figure 24. Typical connection diagram using the ADC
1. Refer to Table 50: ADC characteristics for the values of RAIN, RADC and CADC.
2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
pad capacitance (roughly 7 pF). A high Cparasitic value will downgrade conversion accuracy. To remedy
this, fADC should be reduced.
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure 13: Power supply
scheme. The 10 nF capacitor should be ceramic (good quality) and it should be placed as
close as possible to the chip.
ET = total unajusted error: maximum deviation
between the actual and ideal transfer curves.
EO = offset error: maximum deviation
between the first actual transition and
the first ideal one.
EG = gain error: deviation between the last
ideal transition and the last actual one.
ED = differential linearity error: maximum
deviation between actual steps and the ideal ones.
EL = integral linearity error: maximum deviation
between any actual transition and the end point
correlation line.
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
4095
4094
4093
7
6
5
4
3
2
1
0
23
4
5
6
1
7
4093 4094 4095 4096
VDDA
VSSA
EO
ET
EL
EG
ED
1 LSB IDEAL
(1)
(3)
(2)
MS19880V2
MS33900V1
VDDA
AINx
IL±1 μA
VT
RAIN
(1)
Cparasitic
VAIN
VT
RADC
12-bit
con ver ter
CADC
Sample and hold ADC
con ver ter



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