WNMD2168

Absolute Maximum ratings

Thermal resistance ratings

a

Surface mounted on FR-4 Board using 1 square inch pad size, 1oz copper

b

Surface mounted on FR-4 board using minimum pad size, 1oz copper

c

Pulse width<380µs, Duty Cycle<2%

d

Parameter

Symbol

10 S

Steady State

Unit

Drain-Source Voltage

+20

V

Gate-Source Voltage

±10

Continuous Drain Current

a

5.1

4.1

A

3.8

3.5

Maximum Power Dissipation

a

1.1

0.9

W

0.7

0.6

Continuous Drain Current

b

4.1

3.6

A

3.5

3.0

Maximum Power Dissipation

b

0.9

0.7

W

0.55

0.45

Pulsed Drain Current

c

25

A

Operating Junction Temperature

-55~+150

°C

Lead Temperature

260

°C

Storage Temperature Range

-55~+150

°C

Parameter

Symbol

Typical

Maximum

Unit

Junction-to-Ambient Thermal Resistance

a

t ≤ 10 s

87

110

°C/W

Steady State

113

129

Junction-to-Ambient Thermal Resistance

b

t ≤ 10 s

102

132

Steady State

136

161

Junction-to-Case Thermal Resistance

Steady State

61

75

Will Semiconductor Ltd.

2

Jan, 2015 - Rev.1.1