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SVPL3R306SG - 1.0

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Page 2

SVPL3R306SG Series

2.0 DIAGRAMS

2.1 BLOCK DIAGRAM

2.2 CONNECTION DIAGRAMS

1.

Rtrim should be connected directly across pins 11 and 12 as close as possible to the SVPL.

2.

AGND should be connected to GND close to the SVPL. Voltage difference between the AGND and the GND pins greater than 0.3 V may result in regulation error

and/or damage to the SVPL.

3.

If not using EN, connect pin 7 to VIN.

4.

If not synchronizing converters, use Master Mode Synchronization connections and leave pin 9 open.

5.

If not using PGOOD, leave pin 10 open.

6.

Rcomp and Ccomp are optional components that can be used to optimize the SVPL transient response.

3.0 SPECIFICATIONS

3.1 ABSOLUTE MAXIMUM RATINGS

Absolute Maximum Ratings

-0.3 V to 6.5 V

Operating Temperature (Full Load):

-55 °C to +125 °C

EN, M/S, SYNC

-0.3 V to Vin + 0.3 V

Storage Temperature:

-65 °C to +150 °C

AGND

-0.3 V to 0.3 V

Lead Solder Temperature (10 seconds):

270 °C

ESD Rating per MIL-PRF-38534:

1B

Solder Reflow Temperature (30 seconds):

220 °C

1. Limited to 5.7 V for operation in a heavy ion environment at LET